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Product Type | CPU |
Material | Copper base with Aluminum fin |
Product No. | NYC-B |
Application | Passive |
Compatibility |
Intel® Xeon® Processor (Skylake Server XCC / HCC / LCC) |
Socket | LGA 3647(Socket P) |
Weight(g) | ~425 |
Dimensions | 108L*78W*25.5H (mm) |
Installation Kit | Nut |
Thermal Interface Material | PCM45F |
Fin Process | Stack fin |