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• Application: Intel Core i7, i5 & i3 Mobile processor Socket rBGA989, rBGA1023 & rBGA1364
       • Dimensions: 60 mm (L) x 58mm (W) x 25 mm (H)
       • Material : Copper
       • Fin Pitch : 2.1 mm
       • Fin thickness : 0.5mm
       • Weight : 260 g
       • Backplate : JAT222 included ; Thermal Grease: Shin-Etsu 7762 preprint