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FAQs
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* What is heatsink?                                                         * What is ZIF?
* What is skiving technology?                                       * What is overclocking?
* What is CPU Die?                                                         * What is interface material?
* What is PPGA?                                                              * The difference between the
* What is FC-PGA?                                                              skiving fin and bonding fin /
* What is processor socket?                                             folding fin?
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 Q: What is heatsink?
A: A device, usually constructed of aluminum, a metal alloy or copper, that is attached to a electronic devices and is used to dissipate heat away from the electronic devices. For maximum heat transfer, a heatsink is often used in conjunction with a fan.

 Q:What is skiving technology?
A: Skiving technology is a manufacturing process that produces high surface area heatsink at simple method and low cost. Skiving is cutting the material off in thin layer just like planing timber. The cutting tool and the feed rate control the thickness and pitch of the fins. The skiving heatsink fin has one concave surface and another mirror-like finish surface, and the results in about 50 ~ 70 % reduction in the original length.
For Copper material:
Max. Height : 70 mm & up (depend on the pitch and the thickness)
Min. pitch : 1 mm
For Aluminum material:
Max. Height : 70 mm & up (depend on the pitch and the thickness)
Min. pitch : 1.3 mm

 Q: What are the steps in product development?
A: The steps in product development
1. consulting: thermal specification, space for the cooling management, cost for project
2. design: material, heatsink figure, fin structure, fan, heat pipe, CFD simulation (FLOTHERM)
3. prototype
4. test
5. pilot run
6. review
7. mass production

 Q: What is CPU Die?
A: The square block on the CPU substrate that contains an integrated circuit. This term is often used to refer to an IC without its packaging. The smaller the die size, the less distance between transistors--resulting in lower power consumption and less heat production.

 Q: What is PPGA?
A: Plastic Pin Grid Array. Intel's terminology for the Socket 370 Celeron packaging.

 Q: What is FC-PGA?
A: Flip-Chip Pin Grid Array. A 370-pin form factor for Pentium III CPUs, A 478-pin form factor for Pentium 4 CPUs, and A 462-pin form factor for AMD CPUs. Although the FC-PGA's pinout configuration is similar to that of the Socket 370 (PPGA), they are not compatible.

 Q: What is processor socket?
A: A connector used to mount a CPU on a motherboard. For x86 desktop computers & up, processor sockets are usually of the ZIF (Zero Insertion Force) type, and are used by a wide variety of processors.

 Q: What is ZIF?
A: Zero Insertion Force socket. A type of processor socket designed for easy installation of chips with a high density of pins. You can install a chip in a ZIF socket simply by dropping the chip into the socketOs holes and pulling a lever down to lock the pins into the socket.

 Q: What is overclocking?
A: Running a CPU above its rated speed.

 Q: What is P-rating?
A: Processor Performance Rating. The specification for a methodology created by Cyrix/IBM and AMD to show the performance equivalent for a CPU to an Intel Pentium. The rating shown on the top of the CPU means the Pentium equivalent. (For example, PR-233 means the performance is equal to the Intel Pentium-233, although the CPU is actually running at 66MHz with a ratio of 3x. The actual CPU speed is 66MHz x 3 = 198 MHz.)

 Q: What is interface material?
A: Air ranks low in terms of thermal conductivity, and if trapped between thermal joints, reduces the junction-to-sink thermal resistance and the overall thermal resistance of the system. Thermal interface materials address this problem by providing a buffer between mating surfaces to increase actual points of contact between the junction and the sink. The interface material include phase change material and elastomeric material, and the elastomeric material is classified to thermal grease, thermal tapes and adhesives, thermal compound and thermal foils.

 
Q: The difference between the skiving fin and bonding fin / folding fin?
A: Skiving technology represents a process of shaping materials to keep the joint between the fin and the base being continuous to produce lightweight, high fin density thermal solutions and provide optimal thermal performance. It is different from the manufacturing method of the bonding fin / folding fin that include adhesive, welding, soldering and brazing.
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